Senior Process Integration Engineer, Photonic and Semiconductor Devices
Global semiconductor and display manufacturing equipment company, Bay Area
| Employer | Global semiconductor and display manufacturing equipment company, Bay Area (not named) |
|---|---|
| Location | Santa Clara, CA (Bay Area) · On-site |
| Type & level | Full-time · Senior |
| Pay | USD 147k–202.5k Source: pay range stated in the source posting |
| Visa path | O-1A fit |
| Role family | Process Integration Engineer (Advanced Node) |
About the role
This role leads process integration for advanced semiconductor and photonic devices aimed at high-performance interconnect. The engineer turns device architectures and layouts into manufacturable process flows across development and pilot manufacturing. The work links R&D, process engineering, design and production teams.
What you'll do
- Lead process integration for advanced semiconductor and photonic devices
- Translate device architectures and layouts into robust, manufacturable process flows
- Run rapid proof-of-concept and prototyping builds
- Define and track critical process parameters and integration metrics with module owners
- Own end-to-end flow execution including build scheduling, risk assessment and readiness
- Drive yield improvement, SPC and continuous improvement, and work with outside vendors and customers
Requirements
- Ph.D. in electrical engineering, materials science, physics or a related field (a master's with relevant industry experience may be considered)
- Strong semiconductor process integration experience in a leading fab or foundry
- Solid grasp of unit processes such as lithography, etch, thin film deposition, metallization, implant and CMP
- Strong experience in yield analysis, metrology and SPC
- Experience with simulation and design tools such as Cadence, KLayout, AutoCAD, SolidWorks, COMSOL and ANSYS
- Proven ability to work in matrixed, cross-functional teams
Nice to have
- Experience with photonic devices, co-packaged optics or optical interconnect
- Background in advanced packaging and heterogeneous integration
Pay & benefits
USD 147k–202.5k. The posting mentions a comprehensive benefits package, possible bonus and stock award eligibility, and relocation eligibility.
Pay source: pay range stated in the source posting. Market data, not an offer from O1DMatch.
Visa path
Process integration engineers often support O-1A cases with patents, publications, conference talks, peer review, documented technical leadership, and high compensation relative to peers. The posting states no citizenship restriction. An employer like this or a U.S. agent can file the petition, and approval is never certain.
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